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Tezzaron's Patented Technologies
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®
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Ultra-fast 3T memory cell with
current-sensing circuitry
for SDRAM with pseudo-SRAM performance
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®
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Wafer stacking technology for 3D devices
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TM
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Built in
self-test and repair circuitry
for continuous error detection and recovery
Durable FRAM using proprietary
ferroelectric material
Copyright © 2002-2007 Tezzaron® Semiconductor. All rights reserved.
Revised: July 30, 2008
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