Tezzaron's Patented Technologies:
®
3T-iRAM - Ultra-fast 3T memory cell with current-sensing circuitry
for SDRAM with pseudo-SRAM performance
®
FaStack - Wafer stacking technology for 3D devices
®
Bi-STAR - Built in self-test and repair circuitry for continuous error
detection and recovery
TufFRAM - Durable FRAM using proprietary ferroelectric material
