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FaStack® Creates 3D Integrated Circuits(For the latest achievements in FaStack technology, see the Press links at the bottom of this page.) Tezzaron's groundbreaking FaStack technology creates fast, dense, highly integrated 3D chips. The heart of the process is wafer-level stacking. Device circuitry is divided into sections that are built onto separate wafers using standard processing. The wafers are then post-processed for thru-silicon interconnection, creating hundreds of thousands of vertical "Super-Via™" connectors. The wafers are aligned with a precision of 0.5 micron, then bonded, thinned, and diced into individual devices. A Superior TechnologyBefore FaStack, 3D IC technologies suffered from thermal stress. FaStack solves this problem by ultra-thinning the wafers to prevent thermal build-up; the copper used in the bonding process provides additional thermal relief. FaStack devices have many advantages over their single-layer counterparts. They are much more dense and their short vertical interconnects allow them to operate at higher speeds with a lower power budget. In addition, FaStack allows disparate elements to be processed on separate wafers for simpler production and greater optimization. Unlike the separate chips in a "System-in-Package" (SiP) component, FaStack layers are fully integrated into a single IC by a dense system of through-silicon interconnects. FaStack devices match the tight integration of SoC devices while out-doing SiPs for high speed, low power budget, and tiny footprint. Applications for FaStack®FaStack’s wafer stacking offers benefits to a variety of applications. Sensor arrays, for example, achieve unprecedented density by moving the support circuitry to a different layer than the sensors themselves. “System-on-Chip” (SoC) devices built with FaStack reduce power consumption, footprint, and interconnect delays. Microprocessors built with FaStack incorporate a huge, fast memory cache on a separate layer. FaStack also enables enormous improvements in memory technology and allows seamless integration of differing substrates. As 3D processing moves into the mainstream, entirely new products will emerge to capitalize on this technology. Wafer Stacked SOC (proposed): Fast, Dense, with Mixed Substrates
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