Industry Alliances

3D-IC Alliance
(Tezzaron is a founding member)

Magma Design Automation
(collaboration to develop 3D tools)

CMC Microsystems
(collaboration to provide MPW services)

Micro Magic, Inc.
(collaboration to develop 3D tools)

CMP Multi-Project Circuits
(collaboration to provide MPW services)

The MOSIS Service
(collaboration to provide MPW services)

Singapore Economic Development Board
(Innovative Development Scheme partner)

R3Logic, Inc.
(collaboration to develop 3D tools)

EV Group
(Memorandum of Understanding for
aligner/bonder tool endorsement and pricing)

International SEMI Standards
(Tezzaron employees are task force members)

GLOBALFOUNDRIES
(collaboration to manufacture 3D-enabled wafers)

SVTC Technologies
(agreement for manufacturing)

Honeywell Microelectronics
(collaboration to manufacture radiation-hardened 3D-ICs)

Timension, Inc.
(Ongoing partnership to
develop 3D solutions)

Ziptronix Inc.
(Letter of Intent for Mutual Support)

Institute of Microelectronics
(agreement for research collaboration)