About the Company:
Tezzaron® Semiconductor specializes in high-speed memory products, 3D wafer stacking and TSV
processes, 3D memory elements, and other innovations that propel the semiconductor industry
toward higher performance and greater profitability. The company has produced
extremely fast memory prototypes and is now building
SRAM replacement parts with standard interfaces.
Tezzaron has also demonstrated the world's first successful wafer-stacked 3D ICs, including
stacked microprocessors, stacked
sensors, and stacked
SRAM devices.
In the near term, Tezzaron will:
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Offer high-end memory chips with our blazingly fast
3T-iRAM® technology, out-performing all other
memory technologies.
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Spearhead the industry's move to 3D integrated circuits with our
FaStack® technology, integrating elements
vertically into fast, dense, low-power one-chip solutions.
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Continue to bring cutting edge products to market, creating and patenting ways to
improve the speed, density, and reliability of electronic devices.
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We invite you to explore our company by using the buttons and links at left and right.
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More about the company:
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