| Newspaper and
industry articles on Tezzaron® are listed in reverse chronological order: |
| Date |
Headline |
| 22 June 2010 |
Group
forms another 3-D chip alliance
(EE Times) |
| 22 June 2010 |
CMP/CMC/MOSIS
partner to introduce a 3D-IC process
(CMP/CMC/MOSIS press release) picked up by
Marketwire,
EE
Times Europe, Nanowerk
LLC, R&D,
Earthtimes, FreshNews,
NewsBlaze,
Live-PR,
EDACafe,
PR-inside,
TMCnet,
3D InCites,
ElectroIQ,
Semiconductor
Packaging News, etc. |
| 27 March 2010 |
3-D
IC at the IMAPS Packaging Conference
(Perspectives from the Leading Edge) |
| 22 March 2010 |
IMAPS
Experts Debate 3_D Cost Challenges
(Semiconductor International) |
| 12 January 2010 |
2009
SEMI Awards for North America Bestowed on Robert Patti of Tezzaron
Semiconductor and the Ultratech Laser Annealing Development Team
(SEMI Press Release) Also reported by:
3D InCites: Congratulations,
Bob Patti! (1/14)
Perspectives from the Leading edge: Semi
Award Announced for 3-D IC Activities (1/26)
Rose-Hulman Institute of Technology: Alumnus
Robert Patti Honored as Semiconductor Pioneer (1/18)
|
| 17 December 2009 |
A
good year for 3D start-ups
(3D InCites) |
| 14 December 2009 |
Tezzaron
ties up with SVTC
(CIOL) Picked up by Topix |
| 10 December 2009 |
Tezzaron
tips 3-D memory, signs up SVTC
(EE Times) Picked up by i-Micronews,
CM.NCTU (Taiwan), Hardware.info, SiloBreaker, Topix, and various Twitter
accounts |
| 3 December 2009 |
Researchers
Strive for Copper TSV Reliability
(Semiconductor International) |
| 9 September 2009 |
SEMI
Packaging and Test Workshop Will Focus on KGD and 3D Integration
(SEMI press release) |
| 31 July 2009 |
MCA
Delivers 3D Brightspot at Semicon
(Perspectives from the Leading Edge) |
| 24 July 2009 |
BrightSpots
3D IC Forum, including videos and podcasts
(SemiNeedle online community)
|
| 20 July 2009 |
3-D
IC Technology Continues to Advance
(Semiconductor International) |
| 14 July 2009 |
3D
integration: A status report
(SolidState Technology) |
| 9 July 2009 |
3-D
silicon technology project...
(ILC NewsLine) |
| 7 July 2009 |
3D
Integration: A Progress Report
(SEMI Foundation) |
| 8 June 2009 |
MCA
hosting 3D IC forum
(SolidState Technology) |
| May 2009 |
Can
cost-sharing accelerate 3D IC commercialization?
and
Tezzaron’s
multi-project wafer program: participant perspective
(Francoise in 3D) |
| 1 May 2009 |
Infrastructure
Still Inhibits 3-D ICs
(Semiconductor International)
|
| 12 April 2009 |
3-D
Infrastructure as seen by the IMAPS Global Business Council
(Perspectives from the Leading Edge)
|
| 20 March 2009 |
Like
Swallows Returning to San Juan Capistrano
(Perspectives from the Leading Edge)
|
| 19 March 2009 |
IMAPS
Panelists Address Tough 3-D Challenges
(Semiconductor International)
picked up by Electronic News Today (EDN) |
| 4 March 2009 |
Signs
of 3D Maturity
(Advanced Packaging) |
| 2 February 2009 |
Tezzaron
announces 3D IC Multi Project Wafer Program
(Perspectives from the Leading Edge)
also printed in the March issue of Semiconductor International |
| 30 January 2009 |
The TGIF 3D
Buzz (see last paragraph)
(Francoise in 3D) |
