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Tezzaron® in the News

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Newspaper and industry articles on Tezzaron® are listed in reverse chronological order:
Date Headline
12 January 2010 2009 SEMI Awards for North America Bestowed on Robert Patti of Tezzaron Semiconductor and the Ultratech Laser Annealing Development Team
(SEMI Press Release)  Also reported by:

3D InCites: Congratulations, Bob Patti! (1/14)

Perspectives from the Leading edge: Semi Award Announced for 3-D IC Activities (1/26)

Rose-Hulman Institute of Technology: Alumnus Robert Patti Honored as Semiconductor Pioneer (1/18)
17 December 2009 A good year for 3D start-ups
(3D InCites)
14 December 2009 Tezzaron ties up with SVTC
(CIOL)  Picked up by Topix
10 December 2009 Tezzaron tips 3-D memory, signs up SVTC
(EE Times)  Picked up by i-Micronews, CM.NCTU (Taiwan), Hardware.info, SiloBreaker, Topix, and various Twitter accounts
3 December 2009 Researchers Strive for Copper TSV Reliability
(Semiconductor International)
9 September 2009 SEMI Packaging and Test Workshop Will Focus on KGD and 3D Integration
(SEMI press release)
31 July 2009 MCA Delivers 3D Brightspot at Semicon
(Perspectives from the Leading Edge)
24 July 2009 BrightSpots 3D IC Forum, including videos and podcasts
(SemiNeedle online community)
20 July 2009 3-D IC Technology Continues to Advance
(Semiconductor International)
14 July 2009 3D integration: A status report
(SolidState Technology)
9 July 2009 3-D silicon technology project...
(ILC NewsLine)
7 July 2009 3D Integration: A Progress Report
(SEMI Foundation)
8 June 2009 MCA hosting 3D IC forum
(SolidState Technology)
May 2009 Can cost-sharing accelerate 3D IC commercialization?
and
Tezzaron’s multi-project wafer program: participant perspective
(Francoise in 3D)
1 May 2009 Infrastructure Still Inhibits 3-D ICs
(Semiconductor International)
12 April 2009 3-D Infrastructure as seen by the IMAPS Global Business Council
(Perspectives from the Leading Edge)
20 March 2009 Like Swallows Returning to San Juan Capistrano
(Perspectives from the Leading Edge)
19 March 2009 IMAPS Panelists Address Tough 3-D Challenges
(Semiconductor International)
picked up by Electronic News Today (EDN)
4 March 2009 Signs of 3D Maturity
(Advanced Packaging)
2 February 2009 Tezzaron announces 3D IC Multi Project Wafer Program
(Perspectives from the Leading Edge)
also printed in the March issue of Semiconductor International
30 January 2009 The TGIF 3D Buzz (see last paragraph)
(Francoise in 3D)
For earlier articles:
bulletTezzaron in the News, 2007 and 2008
bulletTezzaron in the News, 2005 and 2006
bulletTezzaron in the News, 2003 and 2004
bulletTezzaron in the News, 2001 and 2002
Copyright © 2007-2010 Tezzaron® Semiconductor. All rights reserved.  Revised: January 27, 2010
 

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