Tezzaron Announces Commercial 3D ICs
Naperville, IL - April 14, 2004
Tezzaron Semiconductor has announced commercially
available products built with its FaStack™ 3D integration process.
These fully integrated three-dimensional circuits (3D ICs) are available
for general purchase; Tezzaron has already received purchase orders.
Tezzaron plans to ship two types of commercial parts by the end of this
quarter: micro-controllers and memory devices.
The FaStack™ micro-controller is a
"super-8051" that runs from 5 to 100 times faster than all
other 8051-type devices. Much of the extra speed is due to 3D
integration of memory layers on top of the processor circuitry.
Featuring a RISC core and up to 512 KBytes of stacked SRAM layers, this
device achieves up to 200 MHz operation, providing 200 MIPS and 100
MFlops.
The FaStack™ 3D memory device is a fast synchronous
burst SRAM with 1, 2, or 4 Megabits in standard packaging. Because
stacking produces a tiny footprint, these same devices could employ
chip-scale packaging of only 7mm x 7mm - one-sixth the size of the
standard 119-BGA.
Both of these devices are built with a 0.18-micron
geometry. The initial roll-out features two-layer parts; soon
thereafter, production will scale up to offer 3-layer parts, with
5-layer parts to follow. Early production is run on a small scale, so
limited numbers of parts will be available for early orders.
FaStack™ 3D ICs are built using wafer-scale 3D
stacking and an extremely high-density array of through-silicon
connectors. Each 3D IC occupies a smaller area than a comparable
two-dimensional device, and its average interconnect length is much
shorter, providing faster access and consuming less power. Unlike a
"3D Package", which contains separate devices (typically
connected at the edges), each 3D IC is a single device, integrated
vertically as well as horizontally for highest performance and maximum
density.
In addition to the general-purchase parts described
above, Tezzaron is sampling semi-custom devices such as 3D CMOS sensors
and 3D cross-point switches. Purchase orders are already in hand for
some of these devices as well. Additional products in the FaStack™
family are currently in development.
Tezzaron Semiconductor is a privately held corporation
with offices in Illinois and Singapore. For product briefs and company
information, visit www.tezzaron.com.
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