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Locations

bulletNaperville (Chicago Area) Office
bulletNaperville Engineers at Work
bulletSingapore Office
bulletSingapore Clean Room

Products & Technologies

bullet"Martin" 3D-IC MPW Project (2011)
bulletVideo of 3D-IC Microprocessor Demonstration (2005)
bullet3D-IC FPGA Prototype (May '05)
bullet3D-IC Sensor Prototype (May '05)
bullet3D-IC SRAM Prototype (January '05)
bulletWafer Pair with Circuitry and Super-Contacts (February '05)
bullet3D-IC Microprocessor Prototype (December '04)
bullet3D-IC RAM Prototype (November '04)
bulletTest Wafer for Prototypes (August '04)
bulletInterconnected Wafer Stack with Super-Vias (June '03)
bullet3T-iRAM® Prototype Chips (PSiRAM) (July/August '03)

Events

bulletTIPP Chicago June 2011
bulletISQED Santa Clara March 2011
bulletIEEE 3DIC Munich November 2010
bullet"Hustle Up the Hancock" February 2007
bulletIME Memorandum of Understanding, March 2006
bullet"Hustle Up the Hancock" February 2006
bulletGlobalCONNECT Forum, December 2005
bulletOffice Party, November 2005
bullet"Hustle Up the Hancock" February 2005
bulletChristmas, 2004
bulletManagement Meeting, April 2004
bullet"Hustle Up the Hancock" February 2004
bullet"Chase Corporate Challenge" August 2003
bullet"Hustle Up the Hancock" February 2003
bulletPresentation at Future 2003 (Taiwan), December 2002
bulletSingapore Holiday Party, December 2002
bulletTechVenture Asia, September 2002
bulletIME Memorandum of Understanding, January 2001
bulletBoard Meeting, October 2000
Copyright © 2002-2011 Tezzaron® Semiconductor. All rights reserved. Revised: November 10, 2011
 

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