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Locations

bulletNaperville (Chicago Area) Office
bulletNaperville Engineers at Work
bulletSingapore Office
bulletSingapore Clean Room

Products & Technologies

bulletVideo of 3D Microprocessor Demonstration (2005)
bulletStacked FPGA Prototype (May '05)
bulletStacked Sensor Prototype (May '05)
bulletStacked SRAM (January '05)
bulletWafer Pair with Circuitry and Super-Contacts (February '05)
bulletStacked Processor (December '04)
bullet3D RAM Prototype (November '04)
bulletInterconnected Wafer Stack with Super-Vias (June '03)
bullet3T-iRAM® Prototype Chips (PSiRAM) (July/August '03)

Events

bullet"Hustle Up the Hancock" February 2007
bulletIME Memorandum of Understanding, March 2006
bullet"Hustle Up the Hancock" February 2006
bulletGlobalCONNECT Forum, December 2005
bulletOffice Party, November 2005
bullet"Hustle Up the Hancock" February 2005
bulletChristmas, 2004
bulletManagement Meeting, April 2004
bullet"Hustle Up the Hancock" February 2004
bullet"Chase Corporate Challenge" August 2003
bullet"Hustle Up the Hancock" February 2003
bulletPresentation at Future 2003 (Taiwan), December 2002
bulletSingapore Holiday Party, December 2002
bulletTechVenture Asia, September 2002
bulletIME Memorandum of Understanding, January 2001
bulletBoard Meeting, October 2000
Copyright © 2002-2009 Tezzaron® Semiconductor. All rights reserved. Revised: March 19, 2009
 

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