Locations
Naperville (Chicago Area) Office
Naperville Engineers at Work
Singapore Office
Singapore Clean Room
Products & Technologies
"Martin" 3D-IC MPW Project
(2011)
Video of 3D-IC Microprocessor Demonstration
(2005)
3D-IC FPGA Prototype
(May '05)
3D-IC Sensor Prototype
(May '05)
3D-IC SRAM Prototype
(January '05)
Wafer Pair with Circuitry and Super-Contacts
(February '05)
3D-IC Microprocessor Prototype
(December '04)
3D-IC RAM Prototype
(November '04)
Test Wafer for Prototypes
(August '04)
Interconnected Wafer Stack with Super-Vias
(June '03)
3T-iRAM® Prototype Chips (PSiRAM)
(July/August '03)
Events
TIPP Chicago June 2011
ISQED Santa Clara March 2011
IEEE 3DIC Munich November 2010
"Hustle Up the Hancock" February 2007
IME Memorandum of Understanding, March 2006
"Hustle Up the Hancock" February 2006
GlobalCONNECT Forum, December 2005
Office Party, November 2005
"Hustle Up the Hancock" February 2005
Christmas, 2004
Management Meeting, April 2004
"Hustle Up the Hancock" February 2004
"Chase Corporate Challenge" August 2003
"Hustle Up the Hancock" February 2003
Presentation at Future 2003 (Taiwan), December 2002
Singapore Holiday Party, December 2002
TechVenture Asia, September 2002
IME Memorandum of Understanding, January 2001
Board Meeting, October 2000
Copyright © 2002-2011 Tezzaron® Semiconductor. All rights reserved. Revised: November 10, 2011
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