The bottom layer of the stack contains circuitry for an 8051-style processor.
August, 2004 - before stacking:
The upper layer of the stack contains SRAM memory circuits.
November, 2004 - after stacking:
This is the lower left corner of the bare
chip - a highly magnified view (actual size 4mm x 4mm). The surface is quite blank because all
the circuitry is inside the stack.
Here the chip is mounted in its test
package. The protective cover was held open for this photo with a bit of tape.
A demo board was designed specifically to
showcase the new processor, which is under the yellow square to the left
of center in this photo.
The demo generates complex "mandelbrot"
patterns, running head-to-head with a standard 8051-type processor. The
Tezzaron processor generates patterns about 3 times faster than the
standard processor. This photo shows the demo being run at the CAST
booth of the 2005 DAC show in California.
For more information about this product, click here.
