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Tezzaron's first stacked 3D-IC prototype was a two-layer register file - a type of RAM.
Click on any picture to see a larger image
| August, 2004 - before stacking
This is the face of one circuit layer, before stacking (actual size: 2mm x 2mm). |
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| November, 2004 - after stacking
When the first register file chips came off the line, this simple test circuit proved that
the chips were "alive." |
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| November, 2004
A complete demonstration platform was created to exercise the functionality of the register
file chip. The chip itself is housed under the bright gold square at the top of the picture.
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| November, 2004
A magnified view of the top of the bare chip (actual size: 2mm x 2mm). The surface of the
chip looks quite blank because the circuitry is on the inside, between the layers of the
stack. The small gold squares are probe points for testing. |
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| November, 2004
A highly magnified view of five of the chip's connectors. |
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| November, 2004
In development, the register file chip was code-named "Orion." A tiny diagram of
the constellation was designed into the top of the chip. |
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Copyright © 2004-2009 Tezzaron® Semiconductor. All rights reserved. Revised:
March 16, 2009
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