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Tezzaron's first 3D stacked prototype is a two-layer register file - a type of RAM.
Click on any picture to see a larger image
August, 2004 - before stacking
This is the face of one circuit layer, before stacking (actual size: 2mm x
2mm).
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November, 2004 - after stacking
When the first register file chips came off the line, this simple test circuit proved that the chips were
"alive." |
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November, 2004
A complete demonstration platform was created to exercise the
functionality of the register file chip. The
chip itself is housed under the bright gold square at the top of the
picture. |
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November, 2004
A magnified view of the top of the bare chip (actual size: 2mm x 2mm). The
surface of the chip looks quite blank because the circuitry is on the
inside, between the layers of the stack. The small gold squares are
probe points for testing. |
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November, 2004
A
highly magnified view of five of the chip's connectors. |
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November, 2004
In
development, the register file chip was code-named "Orion." A
tiny diagram of the constellation was designed into the top of the chip. |
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Copyright © 2004-2005 Tezzaron® Semiconductor. All rights reserved. Revised:
January 10, 2008
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