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| | The IEEE International 3D System Integration Conference (3DIC)
was held 16-18November 2010 in Munich, Germany. Tezzaron's CTO chaired a
session on "3DIC Test." In addition to the full
schedule of 3D-related presentations, the conference featured a special session: "3DIC multi-project fabrication run being organized by CMC Microsystems,
CMP, MOSIS, and Tezzaron"
Click on any picture to see a larger image
November 2010
Speakers and Chairpersons
Tezzaron CTO, Bob Patti,
is 4th from right in the back row. |
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November 2010
Bob enjoyed the conference! |
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Copyright © 2010 Tezzaron® Semiconductor. All rights reserved. Revised:
March 25, 2011
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