Building true 3D-ICs since 2004
Not PowerPoint. Not vapor-ware. Real, working, demonstrated 3D-IC
devices including memories, sensors,
micro-processors, and multi-core
processors. Prototypes built in 2004 are still running without a single
failure to date.
True 3D, not just 2.5D -- TODAY!
Stacked at the wafer level, each layer thinned to as little as 12 microns,
interconnected with through-silicon
vias (TSV); as many as one million TSVs per
square millimeter.
One-micron TSVs -- TODAY!
These incredibly fine vertical connections are applied by the hundreds of thousands,
tightly integrating the several
silicon levels into a single circuit.
More designs delivered than any other supplier
We have delivered scores of finished 3D-IC designs to dozens of customers
including government,
academic, and commercial organizations.
None of the "usual" 3D problems
No temporary bonds; no de-bonding.
Our permanent wafer bonds use a proprietary copper bondpoint pattern.
We never use adhesives or carrier
wafers.
No thin-wafer handling.
By thinning the wafers post-bond, we avoid the warping and deformation
problems that plague other
suppliers.
No copper pumping.
We use tungsten TSV to minimize thermal mismatch and eliminate the stress that
accompanies
copper TSV.
No heat failures.
Using copper for wafer bonding enhances heat flow across the wafer stack and
prevents hot spots. Tezzaron
has tested its 3D-ICs in thousands of
temperature cycles from -65 to +150ºC without a single failure.
Advanced 3D memory technology
Process separation
Memory cells are fabricated separately from the sense amps and other
logic. Memory cell wafers are
optimized for low leakage, using fewer mask
steps because there is no onboard logic. Wafers containing
the logic elements are built in a high speed logic process without the usual
compromises. This win-win
combination creates memories that are
both faster and more reliable than conventional 2D memory devices.
On-board test and repair
Our unique Bi-STAR® circuitry performs initial testing and repair for high
yield, then continues to perform
on-the-fly memory scrubbing and ongoing repair
for longer useful life. Bi-STAR is built into the logic layer of
each Tezzaron 3D memory device.
Patents
Tezzaron owns the rights to important patents that insure the superiority of
our
memory designs.
Clearly the best!
Don't wait for yesterday's promises to happen "someday."
Partner
with the very best -- TODAY!
