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Press Releases

12 June 2007, Chartered, Tezzaron Team Up to Deliver Ultra High-Speed Memory Solution

19 Sept. 2005, Tezzaron Inks Sales Rep Contracts for SRAM

9 May 2005, Tezzaron, PICC to Collaborate on 3D Flash Memory

28 Feb. 2005, Ziptronix®, Tezzaron® Announce Alliance for 3D ICs

24 Jan. 2005, Tezzaron® Unveils 3D SRAM

23 Dec. 2004, 3D Semiconductors Poised for Revolution

6 Dec. 2004, Third Dimension Triples Processor Speed

22 Nov. 2004, Tezzaron Launches RAM in a New Dimension

10 May 2004, Tezzaron Wins $1M in Purchase Orders

14 April 2004, Tezzaron Announces Commercial 3D ICs

18 Aug. 2003, New Memory Technology is World's Fastest

News Articles

10 December 2009,

8 December 2008, Labs and industry perfect 3-D chip (Symmetry)

10 July 2008, 3-D Chip Stacks Standardized (EE Times)

Other news coverage

White Papers

3D-ICs and Integrated Circuit Security -- A white paper (2008) (1.27 MB)

3-D Power Savings -- A discussion (2007)(435 KB)

Techniques for Producing 3D ICs with High-Density Interconnect A presentation from the 2004 VLSI Multi-Level Interconnection Conference (VMIC) (4,052 KB)

Soft Errors in Electronic Memory -- A white paper (87 KB) (updated January 2004)

DRAM Pricing -- A white paper (2002) (1,604 KB)

Management Team

Management Photos and Bios

James T. Ayers, Jr., Chairman, CEO; Director, Tezzaron (Singapore) Pte Ltd

Savely Burd, CFO

Robert Patti, CTO, VP of Design Engineering; Director, Tezzaron (Singapore) Pte Ltd

Dr. Subhash Gupta, VP of Corporate Strategies

Greg Krasick, VP of Sales

Dr. Kenneth S. Su, VP of Business and Technology Development in Asia

Dr. Sangki Hong, Operations Director of Process Development, Tezzaron (Singapore) Pte Ltd

Product and Technology Images

(hi-res versions may be available on request)

3D-IC Microprocessor Demonstration Video (2005)

3D-IC FPGA Prototype (May '05)

3D-IC Sensor Prototype (May '05)

3D-IC SRAM Prototype (January '05)

Wafer Pair with Circuitry and Super-Contacts (February '05)

3D-IC Processor (December '04)

3D-IC RAM Prototype (November '04)

Interconnected Wafer Stack with Super-Vias (June '03)

3T-iRAM® Prototype Chips (PSiRAM) (July/August '03)

Other photos

Media Contact

Gretchen Patti
gpatti@tezzaron.com
Phone: +1-630-505-0404 x109
Fax: +1-630-505-9292

Copyright © 2008-2010 Tezzaron® Semiconductor.  All rights reserved.  Revised: May 14, 2010