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LogoHigh-resolution .gif file, 720x200 7 KB Press Releases12 June 2007, Chartered, Tezzaron Team Up to Deliver Ultra High-Speed Memory Solution 19 Sept. 2005, Tezzaron Inks Sales Rep Contracts for SRAM 9 May 2005, Tezzaron, PICC to Collaborate on 3D Flash Memory 28 Feb. 2005, Ziptronix®, Tezzaron® Announce Alliance for 3D ICs 24 Jan. 2005, Tezzaron® Unveils 3D SRAM 23 Dec. 2004, 3D Semiconductors Poised for Revolution 6 Dec. 2004, Third Dimension Triples Processor Speed 22 Nov. 2004, Tezzaron Launches RAM in a New Dimension 10 May 2004, Tezzaron Wins $1M in Purchase Orders 14 April 2004, Tezzaron Announces Commercial 3D ICs 18 Aug. 2003, New Memory Technology is World's Fastest White Papers3D-ICs and Integrated Circuit Security -- A white paper (2008) (1.27 MB)3-D Power Savings -- A discussion (2007) (435 KB) Techniques for Producing 3D ICs with High-Density Interconnect -- A presentation from the 2004 VLSI Multi-Level Interconnection Conference (VMIC) (4,052 KB) Soft Errors in Electronic Memory -- A white paper (87 KB) (updated January 2004) DRAM Pricing -- A white paper (2002) (1,604 KB) Management TeamJames T. Ayers, Jr., Chairman, CEO; Director, Tezzaron (Singapore) Pte Ltd Savely Burd, CFO Robert Patti, CTO, VP of Design Engineering; Director, Tezzaron (Singapore) Pte Ltd Dr. Subhash Gupta, Managing Director of Tezzaron (Singapore) Pte Ltd Greg Krasick, VP of Sales Dr. Kenneth S. Su, VP of Business and Technology Development in Asia Dr. Sangki Hong, Operations Director of Process Development, Tezzaron (Singapore) Pte Ltd Product and Technology Images(hi-res versions may be available on request) 3D Microprocessor Demonstration Video (2005)Stacked FPGA Prototype (May '05) Stacked Sensor Prototype (May '05) Stacked SRAM (January '05) Wafer Pair with Circuitry and Super-Contacts (February '05) Stacked Processor (December '04) 3D RAM Prototype (November '04) Interconnected Wafer Stack with Super-Vias (June '03) 3T-iRAM® Prototype Chips (PSiRAM) (July/August '03) Media ContactGretchen Patti
Copyright © 2008 Tezzaron® Semiconductor. All rights reserved. Revised: July 30, 2008 |
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