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3D Stacked Microcontroller with SRAM

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bulletTSCR8051Lx Data Sheet (Adobe .pdf format - 1,760 KB)

FaStack® 3D RISC "Super-8051" Microcontroller

World's first 3D-IC processor
Up to 90% power reduction
Industry standard 8051 / 8031 software compatible
RISC architecture with up to x12 speed advantage / MHz over traditional 8051 family devices
Four speed grades: 100, 150, 180, and 200 MHz
128, 256, or 512KB of additional high-speed FaStack® SRAM memory
IEEE 754-compliant floating point coprocessor for full arithmetic capabilities - up to 100 MFlops
Extended 32-bit computing functions including population counter, leading zero counter, and floating-point comparator
Dual data pointers for fast data block moves
Up to 200 MIPS and 100 MFlops
132 PGA or 128 BGA packaging
Full 8051-compatible architecture including:

* Four 8-bit bi-directional ports
* 256 Bytes of "Scratch Pad" memory
* Three 16-bit timer/counters
* Interrupt controller with 12 interrupt sources and 4 priority levels
* 15-bit programmable watchdog timer
* Core 8-bit arithmetic logic unit and 16-bit multiplication division unit
* Two full-duplex serial ports
* Four capture/compare units to generate pulse width modulated signals
* Special Function Register (SFR) interface, serving up to 50 SFR devices

Tezzaron Semiconductor's TSCR8051Lx micro-controllers feature layers of stacked integrated memory. These 8-bit micro-controllers are software compatible with the millions of devices that have been produced since Intel® introduced the 8051 line in 1980. The TSCR8051Lx executes all ASM51 instructions and uses the same instruction set as the 8031.

The TSCR8051Lx uses a Reduced Instruction Set Computer (RISC) core so that many of its instructions are executed in a single clock cycle. This provides a significant speed advantage over traditional 8051 devices that execute an instruction every twelve clock cycles. With clock speeds of up to 200 MHz, the Tezzaron devices are 8051 performance leaders.

The TSCR8051Lx uses Tezzaron's patented FaStack® wafer stacking technology to bond one or more layers of high-speed SRAM over the processor, providing additional Data and Program memory. In the TSCR8051L2, a single SRAM layer provides 128KBytes of partitionable Data and Program memory; in the TSCR8051L3, there are two layers of SRAM (256KBytes); in the TSCR8051L5, four layers (512KBytes).

The TSCR8051Lx features extended 32-bit capabilities including an IEEE 754-compliant floating-point coprocessor with comparator, a multiply/divide unit, a population counter, and a leading-zero counter.

This processor is supported by Keil® Software

For more about Keil® software:

This product is temporarily unavailable (being re-designed).
For product pricing and lead times, contact:
Tezzaron® Semiconductor 630-505-0404 R8051@tezzaron.com

Related pages:

bulletDemonstration Video
bulletProduct Photos
bulletFaStack® Technology
bulletPress:
Tezzaron applies 3D stacking technology to 8051 MCU core (Embedded.com, 22 May 2005)
Tezzaron Chooses CAST IP Core for First Ever Stacked 3D IC Processor (PR Newswire, 18 May 2005)
Six 3D designs precede 90% power-saving claims from Tezzaron (Wall Street & Technology, 23 December 2004)
Tezzaron debuts 'super-8051' chip with 3D technology (Silicon Strategies, 6 December 2004)
Third Dimension Triples Processor Speed (Press Release, 6 December 2004)
Tezzaron Announces Commercial 3D ICs (Press Release, 14 April 2004)
Copyright © 2004-2009 Tezzaron® Semiconductor.  All rights reserved.  Revised: June 12, 2009
 

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