Super-8051:
The "Super-8051" (TSCR8051Lx)
is a Tezzaron 3D-IC device built in the FaStack™
process. This demonstration uses a two-layer IC with vertical interconnections.
One layer of the chip contains an
8051-style processor, the other contains SRAM memory. The chip used
here was built in 2004.
Demo Setup:
The demonstration device contains a Super-8051 and
another fast 8051 processor - the Dallas DS89C420. Each processor runs at its
top speed, executing a program that repeatedly calculates and displays a Mandelbrot fractal
image. The image colors change with each iteration. The two images share a single
monitor, with the Super-8051 image on the upper half and
the other processor's image on the lower half.
Video:
The video was filmed during a live demonstration and then compressed to run six times faster than realtime. The demonstration clearly
shows the speed advantage of the Super-8051, which completes three full
images while the other processor completes about half of one image.
