Full Custom 3D Collaborations

Tezzaron collaborates with academic, commercial, and government groups to create custom 3D-IC designs.
Each customer works with Tezzaron to create proprietary TSV-enabled designs that are built at partner fabs
and stacked at Tezzaron.

If you are interested in creating a custom 3D-IC as an independent project, please contact Tezzaron:
    sales@tezzaron.com     630-505-0404

3D Multi-Project Wafers

Groups of collaborators may choose to build their proprietary 3D designs on a shared wafer, dividing the
costs of mask sets and tooling.  These multi project wafers (MPWs) allow affordable prototyping before
moving a product to full production.  MPW participants have access to Tezzaron's proven FaStack process
and a full Process Design Kit.  The designs are built at our partner foundries and stacked at Tezzaron.

Tezzaron's MPWs are coordinated by the MOSIS service.  If you are interested in creating a custom 3D-IC
as part of an MPW, please see MOSIS for more information.

Copyright © 2011 Tezzaron® Semiconductor.  All rights reserved.  Revised: September 23, 2011